Yonata’s WAT & RDL test systems are multichannel parallel parametric testers designed for efficient wafer acceptance testing (WAT) in advanced semiconductor processes and reliability evaluation of redistribution layers (RDLs) in advanced packaging and chiplet structures.
Combining high-precision SMU technology with femtoampere- and nanovolt-level measurement capabilities and a multichannel parallel architecture, these systems enable fast, precise wafer-level measurements of RDL interconnect resistance, contact resistance, and interlayer dielectric leakage current. This helps identify defects before downstream assembly and packaging.