Yonata’s HBM Known Good Stack Die (KGSD) test system provides full-stack functional testing and reliability evaluation of High Bandwidth Memory (HBM) stacks comprising multiple DRAM dies and a logic base die. Testing is performed after stacking and before integration with host ASICs or interposers.
Beyond KGD screening of individual DRAM dies, the system evaluates interface characteristics specific to TSV-connected stacks, as well as thermal and mechanical stress responses. This helps verify stack quality before integration into AI accelerators and GPUs.