Product Introduction
By combining high-speed optical/electrical signal processing technologies with chip-level handling capabilities, we provide mass-production test solutions for optoelectronic devices.
We develop customized test systems for PIC, OE, and CPO wafer and die testing, tailored to diverse device geometries and test requirements.We design and manufacture our own BERT boards, enabling full RF test capability.Through multi-site testing, we maximize test efficiency and deliver optimal solutions for high-volume production.
Product Lineup
High-Speed Communication Test Solutions
With the advancement of big data, cloud computing, and 5G/AI infrastructure, high-speed communication testing has become a critical foundation for supporting the quality and performance of next-generation networks. Yonata provides comprehensive high-speed communication test solutions centered on DCA, CDR, and BERT for optical transceivers, CPO, and high-speed cables. Supporting evaluations up to the 1.6T class, the solutions cover high-speed optical signal measurement, BER evaluation, protocol and functional verification, as well as high-density testing for mass production, enabling highly efficient and scalable test environments across the R&D, NPI, and mass production phases.
Sampling Oscilloscope DCA6065
Bit Error Rate Tester B3224, B6064C
Electrical Characterization Test Solutions
YONATA’s electrical characterization and WAT test solutions are distinguished by fA/nV-level high precision and triaxial SMU design. By suppressing system leakage current to below 0.5 pA, they are optimized for advanced device applications such as WAT and SiPh. The system adopts a standard PXIe architecture, enabling seamless integration with ATE equipment. In particular, the PPT8200 delivers 24- to 48-channel parallel testing, improving throughput by more than 50% and providing a mass production test solution with performance comparable to Tier 1 vendors at outstanding cost efficiency.
SMU B0201 & B1201 SMU B2031 & B3031
WAT PPT8200
CPO Test Solutions
With the rapid development of AI data centers, high-bandwidth switches, and high-speed interconnects, CPO (Co-Packaged Optics) is gaining attention as a key technology supporting next-generation optoelectronic integration and high-density packaging. Yonata provides a total CPO test solution covering silicon photonics wafer testing, OE die-level testing, and CPO module functional testing. In addition to O/O, O/E, and E/E testing for silicon photonics wafers, the solution also supports optoelectronic dual-side testing of OE bare dies, high-speed optical eye pattern and high-speed electrical signal evaluation, as well as multi-die parallel testing, delivering a highly efficient and scalable test platform for R&D, NPI, and future mass production.
PIC Tester SWT5100
Optical Chip Test Solutions
Specialized solutions for manufacturers of LDs (laser diodes), LiDAR, and PICs (photonic integrated circuits). From wafer-level front-end bare die testing to back-end CoC (Chip on Submount) burn-in and functional testing after submount assembly, Yonata provides end-to-end technical support throughout the entire process.
