Automation & Wafer CompatibilityFully automatic/semi-automatic handling 6 to 12-inch wafers thickness from 200 μm to 2000 μm
Wide Temperature RangeTemperature range up to 150 °C and customizable for wider temperature range
Multi-functional TestingComprehensive O/O, O/E, and E/E testing
Multiple Coupling Methods & High Repeatability Positioning SystemVertical coupling and Edge coupling with fast alignment coupling repeatability < 0.2 dB
Enhanced EfficiencyQuick swappable probe card/FAUs with new concept design and fast calibration
Powerful SoftwareFlexible integration with various functions including calibration, database management and MES
