SiPh Wafer Test System CPO Test System WAT & RDL Test Systems HBM KGSD Test System Advanced Test

Co-Packaged Optics KGD Test System 【OST-3100】

  • Modular Handling & Carrier Compatibility Modular load/unload design supporting standard and customized carrier formats, including Gel-Pak and trays
  • High-Throughput Parallel Testing Supports up to four-site parallel testing
    UPH up to 400 at TT = 0 s
  • High-Speed Electrical Testing Supports at-speed electrical testing for CPO devices
  • High-Precision Pick & Place Pick-and-place accuracy: ≤ ±10 μm
  • Reliable Contact Design Air-damper socket-based design
    Dual-force contact up to 20 kgf, customizable for different applications
  • Wide Temperature Testing Test temperature range from 25 °C to 85 °C
  • Integrated AOI Inspection Supports 6S AOI with 30 μm resolution
    Integrated QR code and OCR systems for device identification and traceability