SiPh Wafer Test System CPO Test System WAT & RDL Test Systems HBM KGSD Test System Advanced Test

HBM KGSD Test System HBM Die Handler【MAT6100DH】

  • Fully Automated Handling Automates KGSD die picking, transport, alignment, probing, and unloading
  • Flexible Binning Single input and output (optional 2 output) open cassette or FOUP (customizable) for OK/NG sorting
    Supports soft binning on wafer frames
  • Parallel Dual-Chuck Design One chuck tests while the other loads, unloads, and aligns dies
  • High-Precision Positioning Supports up to 64/128 dies (customizable)
    Die Positioning accuracy: ≤ ±5 μm.
    Probing accuracy: ≤ ±6.5 μm.
    Chuck flatness: < 20 μm for tri-temperature
  • Tri-Temperature Testing Temperature range: -40 °C to 125 °C ±2 °C
    Supports 64-zone independent temperature control.
  • High Throughput UPH > 800 pcs @ 128 Parallel Site Test, excluding test time
  • Tester Compatibility Compatible with mainstream ATE, including T5833, V93K.
  • Automatic Probe Card Change over / Clean Wafer Loader Reduces setup time and improves production efficiency.